{
  "$type": "site.standard.document",
  "description": "A printed board 2 arranged within an upper case 1 a and having a hole 5, a partition portion 6 arranged within the upper case 1 a so as to be substantially orthogonal to the printed board 2 and provided with a cut 7, and a temperature sensor 3 arranged within the upper case 1 a and having a covered…",
  "path": "/patents/968145",
  "publishedAt": "2014-10-29T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60H1/00657",
    "MITSUBISHI ELECTRIC CORP [JP]"
  ],
  "textContent": "A printed board 2 arranged within an upper case 1 a and having a hole 5, a partition portion 6 arranged within the upper case 1 a so as to be substantially orthogonal to the printed board 2 and provided with a cut 7, and a temperature sensor 3 arranged within the upper case 1 a and having a covered wire 3a, a soldered portion 8 provided at an end of the covered wire 3a, and a temperature detection portion 3b provided at another end of the covered wire 3a, are provided. The temperature sensor 3 is fixed such that the soldered portion 8 is soldered to a surface of the printed board 2, the covered wire 3a is inserted through the hole 5 and engaged with the cut 7 to be fixed, and the temperature detection portion 3b is located near an inner surface of the upper case 1 a.",
  "title": "REMOTE CONTROL DEVICE FOR AIR CONDITIONING"
}