{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreidb2foead5g53lhh2j4luo6hxiousraiwdpzys2ykqrfcfvxcoifq"
    },
    "mimeType": "image/png",
    "size": 105166
  },
  "description": "A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate is described. The arrangement a first chamber configured for liquefying the material, a valve being in fluid communication with the first…",
  "path": "/patents/973247",
  "publishedAt": "2014-06-25T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "C23C14/082",
    "APPLIED MATERIALS INC [US]"
  ],
  "textContent": "A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate is described. The arrangement a first chamber configured for liquefying the material, a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve, an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material, and one or more outlets for directing the vaporized material towards the substrate.",
  "title": "Deposition arrangement, deposition apparatus and method of operation thereof"
}