Electronic Component, Sensor Module, And Method For Manufacturing Electronic Component

An electronic component includes: a substrate including a flexible wiring board having a first surface and a second surface that are in a front and back relationship, and a support plate having a first opening and joined to the first surface of the flexible wiring board; and a first component and a second component both disposed on the substrate. The substrate includes a first region in which the first surface extends along a first direction and a second direction orthogonal to each other, a second region that is disposed on one side of the first region in the first direction and in which the first surface extends along a third direction orthogonal to the first direction and the second direction, and a first coupling region that is located between the first region and the second region and is bent such that a support plate side is located inside. The first component is attached to the first surface in the first region via the first opening. The second component is attached to the second region.