{
  "$type": "site.standard.document",
  "description": "A mounting structure includes base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall that is opposite the inner…",
  "path": "/patents/1363848",
  "publishedAt": "2024-05-23T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60R11/0217",
    "Harman International Industries, Incorporated"
  ],
  "textContent": "A mounting structure includes base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall that is opposite the inner side. The outer side includes a plurality of bumps configured to engage the panel. The base wall includes a plurality of tabs. Each tab configured to receive a corresponding fastener to secure the base wall to the panel.",
  "title": "MOUNTING STRUCTURE FOR MOUNTING AN ELECTRONIC DEVICE"
}