{
  "$type": "site.standard.document",
  "description": "An apparatus is described and includes an integrated circuit (IC) package, the IC package comprising an automotive-grade IC package for automotive applications, the IC package comprising a first chiplet; a second chiplet electrically connected to the first chiplet via a plurality of communications…",
  "path": "/patents/1363852",
  "publishedAt": "2024-05-23T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60R16/023",
    "GM Cruise Holdings LLC"
  ],
  "textContent": "An apparatus is described and includes an integrated circuit (IC) package, the IC package comprising an automotive-grade IC package for automotive applications, the IC package comprising a first chiplet; a second chiplet electrically connected to the first chiplet via a plurality of communications channels; and a monitoring feedback bus for providing information regarding health of the communications channels from the second chiplet to the first chiplet.",
  "title": "TECHNIQUES FOR RESILIENCY IN AUTOMOTIVE-GRADE CHIPLETS"
}