{
  "$type": "site.standard.document",
  "description": "A method for producing a patterned pressure-sensitive adhesive body includes a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first…",
  "path": "/patents/976759",
  "publishedAt": "2014-04-02T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B32B37/14",
    "NITTO DENKO CORP [JP]"
  ],
  "textContent": "A method for producing a patterned pressure-sensitive adhesive body includes a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a first slit in a pattern shape and an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second slit in an outer frame shape surrounding the pattern shape. The second slit has a discontinuous portion in a cutting direction.",
  "title": "Patterned pressure-sensitive adhesive body and producing method thereof"
}