{
  "$type": "site.standard.document",
  "description": "The present invention relates to a high voltage interface device and system, wherein the device comprises: an optical fiber for communication; an insulation device for transmitting ultrasonic waves; a first ultrasonic transducer element, positioned at one end of the insulation device; and a second…",
  "path": "/patents/979120",
  "publishedAt": "2014-01-29T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B06B3/00",
    "SIEMENS AG [DE]"
  ],
  "textContent": "The present invention relates to a high voltage interface device and system, wherein the device comprises: an optical fiber for communication; an insulation device for transmitting ultrasonic waves; a first ultrasonic transducer element, positioned at one end of the insulation device; and a second ultrasonic transducer element, positioned at the other end of the insulation device; wherein the first ultrasonic transducer element is used for converting an inputted electrical power signal to an ultrasonic wave and transmitting the same to the insulation device, and the second ultrasonic transducer element is used for converting the ultrasonic wave from the insulation device to an electrical power signal to be outputted. The device avoids the use of an isolating transformer, and therefore avoids the problems of high weight, large volume and high costs associated with isolating transformers.",
  "title": "High voltage interface device and method based on ultrasound"
}