{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreibqptnbkpburetvw6tlqgzf2ivrumzkn7ztjscf4e6c774ch2h4pq"
    },
    "mimeType": "image/png",
    "size": 106743
  },
  "description": "A semiconductor device package (400) having a cavity (610, 1240) formed using film-assisted molding techniques is provided. Through the use of such techniques the cavity can be formed in specific locations in the molded package, such as on top of a device die (710) mounted on the package substrate…",
  "path": "/patents/980185",
  "publishedAt": "2014-01-01T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60C23/04",
    "FREESCALE SEMICONDUCTOR INC [US]"
  ],
  "textContent": "A semiconductor device package (400) having a cavity (610, 1240) formed using film-assisted molding techniques is provided. Through the use of such techniques the cavity can be formed in specific locations in the molded package, such as on top of a device die (710) mounted on the package substrate or a lead frame (420, 1215). In order to overcome cavity wall angular limitations introduced by conformability issues associated with film-assisted molding, a gel reservoir feature (620, 1260) is formed so that gel (810) used to protect components (720) in the cavity does not come in contact with a lid (910) covering the cavity or the junction between the lid and the package attachment region. The gel reservoir (620, 1260) is used in conjunction with a formed level setting feature (630, 1250) that controls the height of gel in the cavity. Benefits include decreased volume of the cavity, thereby decreasing an amount of gel-fill needed and thus reducing production cost of the package.",
  "title": "Film-assist molded gel-fill cavity package with overflow reservoir"
}