{
  "$type": "site.standard.document",
  "coverImage": {
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  "description": "A heat dissipation structure includes a housing configured to form an accommodation cavity and a heat source disposed in the accommodation cavity. The heat source includes a heat dissipation surface, and the heat source includes a first connecting portion. The heat dissipation structure further…",
  "path": "/patents/1364958",
  "publishedAt": "2024-06-13T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H02B1/56",
    "CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED"
  ],
  "textContent": "A heat dissipation structure includes a housing configured to form an accommodation cavity and a heat source disposed in the accommodation cavity. The heat source includes a heat dissipation surface, and the heat source includes a first connecting portion. The heat dissipation structure further includes a heat transfer block inserted in the housing and including at least one surface exposed outside the housing, a first heat transfer surface, and a second connecting portion. The first connecting portion is connected to the second connecting portion directly or through a connecting piece so that the first heat transfer surface keeps in close fit with the heat dissipation surface.",
  "title": "HEAT DISSIPATION STRUCTURE, HIGH-VOLTAGE DISTRIBUTION BOX, BATTERY, AND ELECTRICAL DEVICE"
}