BONDING STATE INSPECTION APPARATUS AND BONDING STATE INSPECTION METHOD USING THE SAME

Discussed is a bonding state inspection apparatus and a bonding state inspection method using the apparatus, and more particularly to a bonding state inspection apparatus including a transfer unit configured to transfer a battery module having a plurality of battery cells received therein, a thermal image inspection unit configured to scan an upper surface of the battery module, and a shear inspection unit configured to apply a shear force to a bonding ball formed at the battery module and a bonding state inspection method using the same.