{
  "$type": "site.standard.document",
  "description": "A smart ultrasonic integrated-circuit that allows at least one MEMS device to be combined with a piezoelectric transducer in a sensor array module. The sensor array module is capable of additional functionality for an advanced driver assistance system. For example, the MEMS device can add…",
  "path": "/patents/1367492",
  "publishedAt": "2024-08-01T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G01S3/46",
    "SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC"
  ],
  "textContent": "A smart ultrasonic integrated-circuit that allows at least one MEMS device to be combined with a piezoelectric transducer in a sensor array module. The sensor array module is capable of additional functionality for an advanced driver assistance system. For example, the MEMS device can add functionality because its wide bandwidth allows for simultaneous detection of audio signals and ultrasonic signals. Accordingly, the sensor array module may provide dual-mode (audio and ultrasonic) sensing in a single module. Additionally the size/cost of a MEMS device allows for the use of a two-dimensional array for receiving ultrasonic echoes which can add a dimension to the ultrasonic range detection for a vehicle.",
  "title": "SENSOR ARRAY MODULE FOR AN ADVANCED DRIVER ASSISTANCE SYSTEM"
}