{
  "$type": "site.standard.document",
  "description": "Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a…",
  "path": "/patents/987006",
  "publishedAt": "2013-09-11T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B29C44/00",
    "TOYO BOSEKI [JP]"
  ],
  "textContent": "Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having two or more glycidyl groups per molecule, a weight average molecular weight of 4000 to 25000 and an epoxy value of 400 to 2500 Eq/1×10g and an inorganic reinforcing material (C) in a proportion such that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2 to 25 parts by mass and the content of the inorganic reinforcing material (C) is 0 to 350 parts by mass relative to 100 parts by mass of the polyamide resin (A).",
  "title": "EXPANDED POLYAMIDE RESIN MOULDING AND AUTOMOTIVE RESIN MOULDING"
}