{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreiegxlwrnlgmji6waepim3gi6trwt3oxyo3i7uoczbwjfikbiggk5y"
    },
    "mimeType": "image/png",
    "size": 95886
  },
  "description": "A circuit module 14 includes: a lighting control circuit 22 that controls lighting of a semiconductor light emitting element; a first heat radiating member 24 on which the lighting control circuit 22 is mounted; a second heat radiating member 26 that is separated from the first heat radiating…",
  "path": "/patents/987864",
  "publishedAt": "2013-08-07T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60Q1/0094",
    "KOITO MFG CO LTD [JP]"
  ],
  "textContent": "A circuit module 14 includes: a lighting control circuit 22 that controls lighting of a semiconductor light emitting element; a first heat radiating member 24 on which the lighting control circuit 22 is mounted; a second heat radiating member 26 that is separated from the first heat radiating member 24 and has a surface 40a on which the semiconductor light emitting element is mounted; and a connecting mechanism 28 having both a housing 30 that connects the first heat radiating member 24 and the second heat radiating member 26 together and a conductive portion 32 that transmits a signal from the lighting control circuit 22 to the semiconductor light emitting element. The housing 30 is formed of a material having a coefficient of thermal conductivity lower than those of the first heat radiating member 24 and the second heat radiating member 26.",
  "title": "CIRCUIT MODULE, LIGHT-EMITTING MODULE, AND VEHICLE LAMP"
}