Multi-channel cooling bond pad and corresponding cooling method

A cooling bond pad (102, 200, 500) and methods are disclosed. A plurality of internal-cooling channels (112) cool the cooling bond pad (102, 200, 500), and an internal-flow channel (208) is coupled to the internal-cooling channels (112), and directs an internal-coolant flow (302) to the internal-cooling channels (112). An external-flow channel (210) directs a through-coolant flow (304) through the cooling bond pad (102, 200, 500). A method for cooling a cooling bond pad is also provided.