{
  "$type": "site.standard.document",
  "description": "A power converter 110 is proposed, comprising: a semiconductor module 20 including a power semiconductor element 21 to convert DC power to AC power; a capacitor 50 for smoothing the DC power; a DC-side connecting conductor 40 for transmitting the DC power from the capacitor to the semiconductor…",
  "path": "/patents/989490",
  "publishedAt": "2013-06-26T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60L15/007",
    "HITACHI LTD [JP]"
  ],
  "textContent": "A power converter 110 is proposed, comprising: a semiconductor module 20 including a power semiconductor element 21 to convert DC power to AC power; a capacitor 50 for smoothing the DC power; a DC-side connecting conductor 40 for transmitting the DC power from the capacitor to the semiconductor module; a passage forming body 11 that is constructed of a thermally conductive member and forms a passage 28 through which coolant flows; and a case 10 that defines a housing space for housing the semiconductor module and is provided with an opening portion, wherein: the semiconductor module is disposed at one side of the passage forming body and the capacitor is disposed at another side of the passage forming body, opposite to the semiconductor module via the passage forming body; the passage forming body is provided with an opening that communicates with the passage at the side of the passage forming body where the semiconductor module is disposed and a through hole that connects between a space in which the semiconductor module is disposed and a space in which the capacitor is disposed; the semiconductor module is provided with a heat transfer plate 23 on which the power semiconductor element is mounted via an insulating substrate 22; the heat transfer plate closes the opening so as to directly contact with the coolant; the opening portion of the case is closed by the passage forming body in a state in which the semiconductor module is housed in the housing space of the case; and the DC-side connecting conductor extends through the through hole to electrically connect the capacitor with the semiconductor module.",
  "title": "Power converter"
}