ENCLOSURE ASSEMBLY FOR COMPUTING SYSTEM IN AUTONOMOUS VEHICLES

Autonomous driving computing systems in autonomous vehicles can include semiconductor chips with varying degrees of heat dissipation. The semiconductor chips are mounted on a printed circuit board, which together may be packaged in an enclosure assembly. The enclosure assembly may be mounted in the autonomous vehicle. Having a compact or low-profile enclosure assembly, and the harsh operating environment of the autonomous vehicle may pose a challenge for cooling the semiconductor chips and design of the enclosure assembly. Some cooling mechanisms can be difficult to manufacture, assemble, and/or service. An impeller-based intake subassembly can be combined with an air guidance plate that has a hollow structure that can direct air from the intake subassembly towards the printed circuit board through exhaust slots extending from the hollow structure, and air pathways to direct the air across the printed circuit board from the exhaust slots towards an impeller-based exhaust subassembly.