{
  "$type": "site.standard.document",
  "description": "An electrode plate die-cutting apparatus of the present invention includes an original plate support portion 3 that supports an original plate of an electrode plate on a support surface 35, a driving portion that drives a cutting blade, which is arranged with a blade edge facing the original plate…",
  "path": "/patents/993232",
  "publishedAt": "2013-02-06T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B26D7/01",
    "MITSUBISHI HEAVY IND LTD [JP]"
  ],
  "textContent": "An electrode plate die-cutting apparatus of the present invention includes an original plate support portion 3 that supports an original plate of an electrode plate on a support surface 35, a driving portion that drives a cutting blade, which is arranged with a blade edge facing the original plate support portion 3, to move forward or backward, and a pressure adjusting portion 7 that suctions the original plate on the support surface 35 when the cutting blade is moving toward the original plate support portion 3 by the driving portion. For example, the pressure adjusting portion 7 includes a pipe 71, a first branch pipe 72, a first valve 75, and a decompressing portion 74. The vicinity of the support surface 35 is suctioned, and thus the electrode plate is adsorbed onto and fixed to the support surface 35 through a through hole 94 disposed in a sheet 90.",
  "title": "ELECTRODE PLATE MANUFACTURING APPARATUS"
}