{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreih2waoucgzu5zggqgbpyx7wso5eeqegzt6fjqebzl6dhnwdokarwu"
    },
    "mimeType": "image/png",
    "size": 119538
  },
  "description": "A cap assembly including a cap plate including a through hole and a coating layer on at least a portion of an upper surface of the cap plate, a terminal plate including a body part and an inserting part, the inserting part protruding from the body part and into the through hole, an insulator…",
  "path": "/patents/1385739",
  "publishedAt": "2026-06-04T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M50/153",
    "SAMSUNG SDI CO., LTD."
  ],
  "textContent": "A cap assembly including a cap plate including a through hole and a coating layer on at least a portion of an upper surface of the cap plate, a terminal plate including a body part and an inserting part, the inserting part protruding from the body part and into the through hole, an insulator between the cap plate and the terminal plate, and a filler between the inserting part and at least one of the insulator and the cap plate.",
  "title": "CAP ASSEMBLY, SECONDARY BATTERY INCLUDING SAME, AND METHOD FOR MANUFACTURING CAP ASSEMBLY"
}