PATTERNED ELECTRODES

In one aspect of the disclosure, a method is presented. The method involves coating a conductive substrate with an electrode slurry of solvent, active material, binder, and additives to form a wet electrode. The wet electrode is injected with a column of miscible non-solvent fluid into a surface of the wet electrode to displace the electrode slurry around the column and initiate non-solvent-induced phase inversion of the binder in contact with the miscible non-solvent fluid such that the binder in contact with the miscible non-solvent fluid solidifies around the column into a solid-free channel at the surface of and into the wet electrode.