BINDER RESIN COMPOSITION FOR ELECTRODE, ELECTRODE MIXTURE PASTE, AND ELECTRODE

The present invention relates to a binder resin composition for an electrode, including a polyamic acid and a solvent, wherein the polyamic acid is (i) a polyamic acid which includes a tetracarboxylic acid component including 10 to 100 mol% of 4,4'-oxydiphthalic acid and 90 to 0 mol% of 3,3',4,4'-biphenyltetracarboxylic acid and/or pyromellitic acid and a diamine component including an aromatic diamine having 1 to 4 aromatic rings, (ii) a polyamic acid which includes a tetracarboxylic acid component including 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and a diamine component including 10 to 90 mol% of p-phenylene diamine and 90 to 10 mol% of 4,4'-diaminodiphenyl ether, or (iii) a polyamic acid which includes a tetracarboxylic acid component including 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and a diamine component including 40 mol% or more of a bis[4-(4-aminophenoxy)phenyl] compound.