{
  "$type": "site.standard.document",
  "description": "In a vehicle electronic control unit (41), a semiconductor device (52) is mounted on a printed circuit board (51). In the semiconductor device (52), a custom chip (57) and a microcomputer chip (58) are arranged in a package (54), (55) in a stacked manner. On the custom chip (57), a first input…",
  "path": "/patents/1000117",
  "publishedAt": "2012-07-25T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "F02D41/406",
    "KEIHIN CORP [JP]"
  ],
  "textContent": "In a vehicle electronic control unit (41), a semiconductor device (52) is mounted on a printed circuit board (51). In the semiconductor device (52), a custom chip (57) and a microcomputer chip (58) are arranged in a package (54), (55) in a stacked manner. On the custom chip (57), a first input circuit and a first output circuit for inputting and outputting signals or the like to and from the microcomputer chip (58) are formed. On the printed circuit board (51), a second input circuit and a second output circuit for inputting and outputting signals or the like to and from the microcomputer chip (58) while bypassing the custom chip (57) are formed.",
  "title": "ELECTRONIC CONTROL DEVICE FOR VEHICLE"
}