Method of manufacturing a semiconductor apparatus

A method of manufacturing a semiconductor apparatus according to the invention includes the steps of: coating solder 31 on an predetermined area in the upper surface of lead frame 30; mounting chip 32 on solder 31; melting solder 31 with hot plate 33 for bonding chip 32 to lead frame 30; wiring with bonding wires 34; turning lead frame 30 upside down; placing lead frame 30 turned upside down on heating cradle 35; coating solder 36, the melting point of which is lower than the solder 31 melting point; mounting electronic part 37 on solder 36; and melting solder 36 with heating cradle 35 for bonding electronic part 37 to lead frame 30. The bonding with solder 36 is conducted at a high ambient temperature. The semiconductor apparatus and the manufacturing method thereof facilitate mounting semiconductor devices and electronic parts on both surfaces of a lead frame divided to form wiring circuits without through complicated manufacturing steps.