{
  "$type": "site.standard.document",
  "description": "A solid-state imaging device according to an embodiment of the present disclosure includes a stacked photoelectric converter for each of a plurality of pixels. The stacked photoelectric converter has a plurality of photoelectric conversion elements stacked therein. The plurality of photoelectric…",
  "path": "/patents/1378194",
  "publishedAt": "2026-01-22T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H10F39/8023",
    "SONY SEMICONDUCTOR SOLUTIONS CORPORATION"
  ],
  "textContent": "A solid-state imaging device according to an embodiment of the present disclosure includes a stacked photoelectric converter for each of a plurality of pixels. The stacked photoelectric converter has a plurality of photoelectric conversion elements stacked therein. The plurality of photoelectric conversion elements each has different wavelength selectivity. This solid-state imaging device further includes a plurality of data output lines from which pixel signals based on electric charges outputted from the photoelectric conversion elements are outputted. A plurality of data output lines is provided for each predetermined unit pixel column. The plurality of the data output lines is equal in number to an integer multiple of the photoelectric conversion elements stacked in the stacked photoelectric converter.",
  "title": "SOLID-STATE IMAGING DEVICE"
}