{
  "$type": "site.standard.document",
  "description": "Systems and methods for mounting inertial sensors on a board 64. On a wafer containing one or more sensor packages having a substrate layer 32, 34, a sensor layer 24 and an insulator layer 26, 28 located between the sensor layer and the substrate layer, a V-groove is anisotropically etched into one…",
  "path": "/patents/1005612",
  "publishedAt": "2012-02-01T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B81B7/0074",
    "HONEYWELL INT INC [US]"
  ],
  "textContent": "Systems and methods for mounting inertial sensors on a board 64. On a wafer containing one or more sensor packages having a substrate layer 32, 34, a sensor layer 24 and an insulator layer 26, 28 located between the sensor layer and the substrate layer, a V-groove is anisotropically etched into one of the substrate layer. The substrate layer is in the 100 crystal plane orientation. The sensor package is then separated from the wafer. Then, a surface of the substrate layer formed by the etching is attached to a board. In one example, three sensor packages are mounted to the board so that their sense axis are perpendicular to each other.",
  "title": "Systems and methods for mounting inertial sensors"
}