{
  "$type": "site.standard.document",
  "description": "A cooling system (110) for a hot gas path component (100) is disclosed. The cooling system (110) may include a component layer (120) and a cover layer (125). The component layer (120) may include a first inner surface (122) and a second outer surface (124). The second outer surface (124) may define…",
  "path": "/patents/1008241",
  "publishedAt": "2011-10-26T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "F01D25/12",
    "GEN ELECTRIC [US]"
  ],
  "textContent": "A cooling system (110) for a hot gas path component (100) is disclosed. The cooling system (110) may include a component layer (120) and a cover layer (125). The component layer (120) may include a first inner surface (122) and a second outer surface (124). The second outer surface (124) may define a plurality of channels (130). The component layer (120) may further define a plurality of passages (140) extending generally between the first inner surface (122) and the second outer surface (124). Each of the plurality of channels (130) may be fluidly connected to at least one of the plurality of passages (140). The cover layer (125) may be situated adjacent the second outer surface (124) of the component layer (120). The plurality of passages (140) may be configured to flow a cooling medium (90) to the plurality of channels (130) and provide impingement cooling to the cover layer (125). The plurality of channels (130) may be configured to flow cooling medium (90) therethrough, cooling the cover layer (125).",
  "title": "Hot gas path component cooling system"
}