{
  "$type": "site.standard.document",
  "description": "A sensor device 1 includes: a silicon substrate 10; a first electrode 11 provided at an active surface 10a side of the silicon substrate 10; an external connection terminal 12 provided at the active surface 10a side so as to be electrically connected to the first electrode 11; a stress relief layer…",
  "path": "/patents/1009644",
  "publishedAt": "2011-09-07T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G01C19/5628",
    "SEIKO EPSON CORP [JP]"
  ],
  "textContent": "A sensor device 1 includes: a silicon substrate 10; a first electrode 11 provided at an active surface 10a side of the silicon substrate 10; an external connection terminal 12 provided at the active surface 10a side so as to be electrically connected to the first electrode 11; a stress relief layer 15 provided between the silicon substrate 10 and the external connection terminal 12; and a vibrating gyro element 20 as a sensor element including a extraction electrode 29. The vibrating gyro element 20 is held to the silicon substrate 10 by connection between the extraction electrode 29 and the external connection terminal 12.",
  "title": "Motion sensor, and method of manufacturing motion sensor"
}