{
  "$type": "site.standard.document",
  "description": "A method for forming an overmolded interconnect device includes molding a first layer of an automotive component having a surface, depositing conductive material onto a portion of the surface, and molding a second layer over the surface to substantially enclose at least a portion of the conductive…",
  "path": "/patents/1382375",
  "publishedAt": "2026-05-07T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H02G3/28",
    "Valeo Vision"
  ],
  "textContent": "A method for forming an overmolded interconnect device includes molding a first layer of an automotive component having a surface, depositing conductive material onto a portion of the surface, and molding a second layer over the surface to substantially enclose at least a portion of the conductive material between the first layer and the second layer.",
  "title": "Overmolded Interconnect Device"
}