{
  "$type": "site.standard.document",
  "description": "Connection portions (225UP through 225W) to which upper arm control terminals (320UU through 320UW) are connected are disposed at a first edge portion of a drive circuit board (22). And connection portions (225sun through 225WN to which lower arm control terminals (320LU through 320LW) are…",
  "path": "/patents/1011788",
  "publishedAt": "2011-06-22T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60L15/007",
    "HITACHI AUTOMOTIVE SYSTEMS LTD [JP]"
  ],
  "textContent": "Connection portions (225UP through 225W) to which upper arm control terminals (320UU through 320UW) are connected are disposed at a first edge portion of a drive circuit board (22). And connection portions (225sun through 225WN to which lower arm control terminals (320LU through 320LW) are connected are disposed at a second edge portion of the drive circuit board (22) Upper arm implementation regions (227UP through 227WP), lower arm implementation regions (227UN through 227WN), and a low voltage pattern region (228) in which photo-couplers (221U through 221W) are implemented are formed in the board region between these board edge portions. And signal wiring (40U) that transmits a control signal from a photo-coupler (221U) to an implementation region (227UN) is formed in a conductor layer that is a lower layer than the conductor layer in the lower arm implementation region in which the lower arm driver circuit is implemented",
  "title": "POWER CONVERTER"
}