{
  "$type": "site.standard.document",
  "description": "The present invention utilizes self-heating of electronic components to improve a humidity sensing part 500 with low environment resistance, such as a condensation problem and the like, and also to enhance the heat radiation efficiency of electronic components. The humidity sensing part 500 is used…",
  "path": "/patents/1014128",
  "publishedAt": "2011-04-06T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "F02D41/187",
    "HITACHI AUTOMOTIVE SYSTEMS LTD [JP]"
  ],
  "textContent": "The present invention utilizes self-heating of electronic components to improve a humidity sensing part 500 with low environment resistance, such as a condensation problem and the like, and also to enhance the heat radiation efficiency of electronic components. The humidity sensing part 500 is used in an intake tube 101 of an automobile by integrating, for example, with a heating resister type mass air flow measurement device 200. A humidity sensing element is mounted on an electronic circuit board 203 in a mass air flow measurement device 200 with the temperature thereof starting to increase immediately after a sensor has been actuated. This urges the temperature of the humidity sensing element to start increasing (being heated) immediately after the sensor has been actuated. To urge the humidity sensing element to be further heated, a base plate 202 is composed of two types of materials, resin and metal. A part of the base plate 202 holding an area of the electronic circuit board 203 generating a large quantity of heat is composed of the metal. A part of the base plate 202 corresponding to the periphery of the humidity sensing part 500 which is to be heated is composed of the resin.",
  "title": "Flow rate sensor structure"
}