{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
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  "description": "Wireless power supply and information communication are achieved between electronic circuit substrates in the electronic equipment, and the size of the means for achieving the above is reduced. There are provided a first electronic circuit substrate 2, a second electronic circuit substrate 4, a…",
  "path": "/patents/1015774",
  "publishedAt": "2011-02-16T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01F27/2804",
    "MITSUBISHI ELECTRIC CORP [JP]"
  ],
  "textContent": "Wireless power supply and information communication are achieved between electronic circuit substrates in the electronic equipment, and the size of the means for achieving the above is reduced. There are provided a first electronic circuit substrate 2, a second electronic circuit substrate 4, a first coil 3a connected to the first electronic circuit substrate 2, and a second coil 3b connected to the second electronic circuit substrate 4. Power is transmitted from the first coil 3a to the second coil 3b by electromagnetic induction so that the first electronic circuit substrate 2 and the second electronic circuit substrate 4 are electrically connected.",
  "title": "ELECTRONIC DEVICE AND METHOD FOR CONNECTING ELECTRONIC CIRCUIT BOARD"
}