{
  "$type": "site.standard.document",
  "description": "A substrate provided in proximity to a case for improving heat radiation, and maintaining electrical insulation between the substrate and the case even when the substrate is warped, in the substrate having electronic parts mounted thereon and a case for housing the substrate. A case body of the…",
  "path": "/patents/1221522",
  "publishedAt": "2018-11-29T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K1/0271",
    "NSK LTD."
  ],
  "textContent": "A substrate provided in proximity to a case for improving heat radiation, and maintaining electrical insulation between the substrate and the case even when the substrate is warped, in the substrate having electronic parts mounted thereon and a case for housing the substrate. A case body of the case has a substrate placement surface for placing the substrate, the substrate placement surface is provided with a protruding portion protruding therefrom, and the substrate is fixed on the substrate placement surface, via a thermal interface material disposed on the substrate placement surface from a periphery of the protruding portion.",
  "title": "STRUCTURE OF SUBSTRATE HAVING ELECTRONIC PARTS MOUNTED THEREON AND CASE FOR HOUSING THE SUBSTRATE"
}