{
  "$type": "site.standard.document",
  "description": "A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the…",
  "path": "/patents/1200119",
  "publishedAt": "2018-02-01T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K1/0203",
    "Samsung Electronics Co., Ltd."
  ],
  "textContent": "A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the heat generation body, and a coil FPCB attached between the internal support structure and the shield can, wherein the internal support structure includes an air volume space configured to block conduction of high-temperature heat produced by the heat generation body and cause thermal radiation and convection.",
  "title": "HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME"
}