Method for production of semiconductor package

A method for production of a semiconductor package which enables uniform conduction processing for all through holes covered by the conduction processing without being limited to any specific structure, is free from surface relief shapes and internal voids, and enables conduction processing simply, in a short time, at a low cost utilizing existing facilities, wherein the conduction processing of the through holes includes a step of press fitting a conductor (20) into the through holes (10) by a ball bonder and a step of flattening the exposed heads of the press-fit conductors (20A) by coining.