{
  "$type": "site.standard.document",
  "description": "A patch (20) having integrated electronics and positioned within the structure of a tire is provided. A process for integrating such patch within a tire is also provided. The patch is placed within the tire structure as opposed to resting on a tire surface. The patch may be attached within the tire…",
  "path": "/patents/1072291",
  "publishedAt": "2005-11-23T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60C23/0493",
    "MICHELIN SOC TECH [FR]"
  ],
  "textContent": "A patch (20) having integrated electronics and positioned within the structure of a tire is provided. A process for integrating such patch within a tire is also provided. The patch is placed within the tire structure as opposed to resting on a tire surface. The patch may be attached within the tire structure using adhesives or may be bonded within the tire structure through a curing process.",
  "title": "A process and device for incorporating electronics into a tire"
}