{
  "$type": "site.standard.document",
  "description": "A semiconductor structure includes a transceiver configured to communicate with a device, a molding surrounding the transceiver, a via extending through the molding, an insulating layer disposed over the molding, the via and the transceiver, and a redistribution layer (RDL) disposed over the…",
  "path": "/patents/1182087",
  "publishedAt": "2017-05-04T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H02J7/025",
    "TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD."
  ],
  "textContent": "A semiconductor structure includes a transceiver configured to communicate with a device, a molding surrounding the transceiver, a via extending through the molding, an insulating layer disposed over the molding, the via and the transceiver, and a redistribution layer (RDL) disposed over the insulating layer and comprising an antenna and a dielectric layer surrounding the antenna, wherein a portion of the antenna is extended through the insulating layer and the molding to electrically connect with the transceiver.",
  "title": "SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF"
}