{
  "$type": "site.standard.document",
  "description": "A method for fabricating a filtering member in which overlapping portions of a wire are bonded together in a layered manner through thermal treatment for forming a mesh is disclosed. In accordance with the method, a contact surface pressure between portions of the wire to be bonded together is…",
  "path": "/patents/1072768",
  "publishedAt": "2005-11-09T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B01D39/10",
    "CHUO HATSUJO KK [JP]"
  ],
  "textContent": "A method for fabricating a filtering member in which overlapping portions of a wire are bonded together in a layered manner through thermal treatment for forming a mesh is disclosed. In accordance with the method, a contact surface pressure between portions of the wire to be bonded together is maintained as equal to or higher than a predetermined level set depending on a thermal treatment condition. In this state, the thermal treatment is conducted such that a bonding portion of the wire has a strength equal to or greater than 4N.",
  "title": "FILTER MEMBER PRODUCING METHOD"
}