{
  "$type": "site.standard.document",
  "description": "A sealed electronic module (26) is manufactured by forming a housing (18) that is open at one end (18b), dispensing a first quantity of potting material (20) into the housing (18) via the open end (18b), inserting a circuit board (12) and electrical connector assembly (16) into the housing (18) so…",
  "path": "/patents/1073731",
  "publishedAt": "2005-09-28T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60R16/0239",
    "DELPHI TECH INC [US]"
  ],
  "textContent": "A sealed electronic module (26) is manufactured by forming a housing (18) that is open at one end (18b), dispensing a first quantity of potting material (20) into the housing (18) via the open end (18b), inserting a circuit board (12) and electrical connector assembly (16) into the housing (18) so that the inboard end (12b) of the circuit board (12) is immersed in the potting material (20), and dispensing a second quantity of potting material (30) into an area (28) bridging the connector assembly (16) and the housing (18). When cured, the first quantity of potting material (20) attaches the inboard end (12b) of the circuit board (12) to the housing (18), and the second quantity of potting material (30) attaches the connector (16) to the housing (18) and environmentally seals the module (26).",
  "title": "Method of manufacturing a sealed electronic module"
}