{
  "$type": "site.standard.document",
  "description": "A flexible membrane (100) for a polishing head (4) and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane (100) for a polishing head (4) includes a compressing plate (110) having a first face (111) and a second face (112) opposite to the first face…",
  "path": "/patents/1075167",
  "publishedAt": "2005-08-10T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B24B37/30",
    "SAMSUNG ELECTRONICS CO LTD [KR]"
  ],
  "textContent": "A flexible membrane (100) for a polishing head (4) and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane (100) for a polishing head (4) includes a compressing plate (110) having a first face (111) and a second face (112) opposite to the first face. The first face (111) of the compressing plate (110) holds a substrate (S) with a vacuum (VP) provided thereto and compresses the substrate (S) on a polishing pad (3). The second face (112) of the compressing plate (110) is combined with a supporter (620) of the polishing head (4). The second face (112) and the supporter (620) define a space (MZ1) to which the vacuum (VP) for holding the substrate (S) and a first pneumatic pressure (MP1) for compressing the substrate (S) are applied. A dividing member (120,130) combined with the supporter (620) is formed on the second face (112). The dividing member (120,130) divides the space into at least two regions. A pneumatic pressure-introducing portion (125,135) is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate (110) through the pneumatic pressure-introducing (125,135) portion.",
  "title": "Flexible membrane for a polishing head and CMP apparatus having the same"
}