{
  "$type": "site.standard.document",
  "description": "In one aspect, a microelectromechanical device and method of producing the device includes an accelerometer (110) with a thinned flexure structure (112). In another embodiment, the device and method of producing the device includes an accelerometer (110) and a pressure sensor (120) integrated on a…",
  "path": "/patents/1075175",
  "publishedAt": "2005-08-10T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60C23/0408",
    "GEN ELECTRIC [US]"
  ],
  "textContent": "In one aspect, a microelectromechanical device and method of producing the device includes an accelerometer (110) with a thinned flexure structure (112). In another embodiment, the device and method of producing the device includes an accelerometer (110) and a pressure sensor (120) integrated on a single chip (100).",
  "title": "Micromechanical device with thinned cantilever structure and related methods"
}