{
  "$type": "site.standard.document",
  "description": "The method involves applying a colloidal solution comprising particles and a solvent to a substrate. The solution is dried, the particles in the solution are allowed to remain on the substrate, and the particles are sintered on the substrate. The substrate and the particles have electrodes or…",
  "path": "/patents/1081224",
  "publishedAt": "2004-12-29T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M4/04",
    "HEWLETT PACKARD DEVELOPMENT CO [US]"
  ],
  "textContent": "The method involves applying a colloidal solution comprising particles and a solvent to a substrate. The solution is dried, the particles in the solution are allowed to remain on the substrate, and the particles are sintered on the substrate. The substrate and the particles have electrodes or electrolyte. The substrate is porous and size of an average diameter of the particles is larger than the average diameter of pores.",
  "title": "Methods for applying electrodes or electrolytes to a substrate"
}