{
  "$type": "site.standard.document",
  "description": "A conductive resin molding is formed by molding a resin composition, which comprises a thermoplastic resin and graphite and contains 1 - 9 vol.% (based on 100 vol% of the resin composition) of high boiling point oil. The high boiling point oil is at least one oil selected from aromatic hydrocarbon…",
  "path": "/patents/1081301",
  "publishedAt": "2004-12-29T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "C08K3/04",
    "NTN TOYO BEARING CO LTD [JP]"
  ],
  "textContent": "A conductive resin molding is formed by molding a resin composition, which comprises a thermoplastic resin and graphite and contains 1 - 9 vol.% (based on 100 vol% of the resin composition) of high boiling point oil. The high boiling point oil is at least one oil selected from aromatic hydrocarbon oils and silicone oils.",
  "title": "CONDUCTIVE RESIN MOLDING"
}