Structure for installing highvoltage equipment component to vehicle

A high-voltage equipment component is disposed in a recessed accommodating portion which is formed on a vehicle body floor in such a manner as to be recessed downwardly. The high-voltage equipment component is accommodated in the recessed accommodating portion in a suspended state via a sub-assembly frame which is supported on the vehicle body floor. A heat insulating member for forming a flow path for allowing cooling air to flow towards the high-voltage equipment component is interposed between the high-voltage equipment component and a bottom portion of the recessed accommodating portion.