{
  "$type": "site.standard.document",
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  "description": "A high-voltage solid-state switching assembly for use in an electric power transmission, subtransmission, or distribution network. The assembly includes a press-pack semiconductor switching stack including solid-state switching devices connected in series. The assembly further includes a…",
  "path": "/patents/1114860",
  "publishedAt": "2026-05-28T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H02B1/04",
    "MICATU INC."
  ],
  "textContent": "A high-voltage solid-state switching assembly for use in an electric power transmission, subtransmission, or distribution network. The assembly includes a press-pack semiconductor switching stack including solid-state switching devices connected in series. The assembly further includes a pressure-distribution mechanism including a pressure cone, compression plate, and spring system configured to maintain substantially uniform contact pressure across the press-pack semiconductor switching stack during thermal and electrical cycling. The assembly further includes a dielectric insulation chamber containing an insulating medium selected from air, nitrogen, insulating oil, fluorinated dielectric gas, SF-free insulating gas, and a combination thereof, the dielectric insulation chamber being dimensioned to provide required creepage and clearance distances for the intended system voltage. The assembly further includes a thermal-management arrangement including at least one of a heat sink, external fin, radiator plate, and convection-promoting channel configured to dissipate heat generated by the press-pack semiconductor switching stack during operation.",
  "title": "MODULAR HIGH-VOLTAGE SWITCHING SYSTEM AND METHOD"
}