{
  "$type": "site.standard.document",
  "description": "The present invention reduces components of a circuit board and miniaturizes a battery pack using a thermostat. The battery pack includes a thermostat (9) having a casing portion (10) formed of a nonconductive material, a first electrode portion (13) disposed at one surface (10a) of the casing…",
  "path": "/patents/1086227",
  "publishedAt": "2004-06-23T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01H37/043",
    "SONY CORP [JP]"
  ],
  "textContent": "The present invention reduces components of a circuit board and miniaturizes a battery pack using a thermostat. The battery pack includes a thermostat (9) having a casing portion (10) formed of a nonconductive material, a first electrode portion (13) disposed at one surface (10a) of the casing portion, and a second electrode portion (18) and (18) disposed at another surface (10c) opposite to the one surface of the casing portion, wherein one electrode lead (5) projected from a battery cell (3) is connected to one electrode connecting portion (7) of a circuit board (4); another electrode lead (6) is connected to the first electrode portion of the thermostat; and the second electrode portion of the thermostat is connected to another electrode connecting portion (8) of the circuit board.",
  "title": "BATTERY PACK AND THERMOSTAT USED FOR IT"
}