Method and device for removing material to workpieces with a laser

Process for controlled and/or regulated processing of workpieces (10) using laser cutting comprises monitoring the processing via sensors. The vibrations produced in the material during laser cutting are detected so that a correlation to the laser parameters such as energy, amplitude and/or phase position on the current processing state can be also concluded via evaluation of the detector signal. Independent claims are also included for the following: (1) device for controlled and/or regulated processing of workpieces using laser cutting comprising a controlled laser and sensors designed as vibration detectors (12), especially laser vibrometers; and (2) software program product.