{
  "$type": "site.standard.document",
  "description": "A method for forming a channel (80) within a coated (72, 74), metal-based substrate (54) is described. In one technique, a channel-forming material (50) is first deposited on the substrate (54), followed by the deposition of a bonding agent (58), such as a braze. One or more coatings (72, 74) can…",
  "path": "/patents/1090790",
  "publishedAt": "2004-01-07T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B23P15/008",
    "GEN ELECTRIC [US]"
  ],
  "textContent": "A method for forming a channel (80) within a coated (72, 74), metal-based substrate (54) is described. In one technique, a channel-forming material (50) is first deposited on the substrate (54), followed by the deposition of a bonding agent (58), such as a braze. One or more coatings (72, 74) can then be applied over the substrate (54). In one embodiment, the channel (80) is formed when the channel-forming material (50) is subsequently removed. In another embodiment, the channel (20) is formed due to the lack of adhesion between particular channel-forming materials (10) and the overlying bonding agent (18). Related articles are also described, e.g., gas turbine components which include protective coatings and a pattern of cooling channels.",
  "title": "Method of forming a hollow channel on the surface of a metal substrate, and related articles"
}