{
  "$type": "site.standard.document",
  "description": "A piezoelectric device includes a substrate, a buffer layer on the substrate, a lower electrode layer on the buffer layer, a piezoelectric layer on the lower electrode layer, and an upper electrode layer on the piezoelectric layer. The piezoelectric layer has a base portion extending outwardly at…",
  "path": "/patents/1092304",
  "publishedAt": "2003-10-29T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G01C19/5607",
    "MATSUSHITA ELECTRIC INDUSTRIAL CO LTD [JP]"
  ],
  "textContent": "A piezoelectric device includes a substrate, a buffer layer on the substrate, a lower electrode layer on the buffer layer, a piezoelectric layer on the lower electrode layer, and an upper electrode layer on the piezoelectric layer. The piezoelectric layer has a base portion extending outwardly at its lower portion of its periphery. The piezoelectric device provides enhanced bonding strength between the substrate and the stacked structure including the upper electrode layer, the lower electrode layer, and the piezoelectric layer.",
  "title": "PIEZOELECTRIC FUNCTIONAL PART AND METHOD OF MANUFACTURING THE PART"
}