{
  "$type": "site.standard.document",
  "description": "A sound absorbing structure including a film with through holes formed is laminated on a porous member having communicating voids on the side facing a sound source. At least one of the through holes has an opening area of 19 mm or more, and the total of the opening area accounts for 1 to 70% with…",
  "path": "/patents/1106052",
  "publishedAt": "2002-03-13T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "F02B77/13",
    "NICHIAS CORP [JP]"
  ],
  "textContent": "A sound absorbing structure including a film with through holes formed is laminated on a porous member having communicating voids on the side facing a sound source. At least one of the through holes has an opening area of 19 mm or more, and the total of the opening area accounts for 1 to 70% with respect to the area of a film formation surface on the porous member. A soundproof cover including the sound absorbing structure disposed on the inner surface of a cover main body are also provided.",
  "title": "Sound absorbing structure"
}