{
  "$type": "site.standard.document",
  "description": "An excellent low temperature heat sealing property is imparted to a surface of a non-perfluoro fluorine-containing resin molded article having F/C of not more than 1.8. A non-perfluoro fluorine-containing resin molded article having a surface layer portion having a low temperature heat sealing…",
  "path": "/patents/1108202",
  "publishedAt": "2001-12-05T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B32B27/08",
    "DAIKIN IND LTD [JP]"
  ],
  "textContent": "An excellent low temperature heat sealing property is imparted to a surface of a non-perfluoro fluorine-containing resin molded article having F/C of not more than 1.8. A non-perfluoro fluorine-containing resin molded article having a surface layer portion having a low temperature heat sealing property on at least a part of the surface layer thereof; said surface layer portion having a low temperature heat-sealing property has a ratio F/C of the number of fluorine atoms to the number of carbon atoms of 0.2",
  "title": "NON-PERFLUORO FLUORORESIN MOLDED ARTICLE HAVING LOW-TEMPERATURE HEAT SEALABILITY"
}