{
  "$type": "site.standard.document",
  "bskyPostRef": {
    "cid": "bafyreicqhzdujaegq63eoz7gmppeshnqsifq6ejkflxxdwy2yxfbadyn7e",
    "uri": "at://did:plc:nfsnsnlxecvkeogkvjmy2u25/app.bsky.feed.post/3mjlsgn53sjq2"
  },
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreicjvzfuhihubk34p4o42k76kbhdz4mvwmlxtmn3xc2ar5uuqmhvsm"
    },
    "mimeType": "image/webp",
    "size": 47720
  },
  "path": "/article/247760",
  "publishedAt": "2026-04-16T04:48:00.000Z",
  "site": "https://www.cool3c.com",
  "tags": [
    "科技應用",
    "處理器",
    "AI",
    "網路",
    "broadcom",
    "meta",
    "博通",
    "市場動態",
    "頭條話題",
    "人工智慧",
    "2nm"
  ],
  "textContent": "Meta 擴大與 Broadcom 合作，將共同開發多代 MTIA 客製化 AI 晶片，整合其 XPU 平台與網路技術，建構逾 1GW 的「個人超級智慧」基礎設施。",
  "title": "Meta 與博通合作開發 2nm AI 晶片 MTIA 初期部署超 1GW"
}